The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Dec. 01, 2011
Applicants:

Yasushi Tsujimura, Kanonji, JP;

Daisuke Yasuki, Kanonji, JP;

Inventors:

Yasushi Tsujimura, Kanonji, JP;

Daisuke Yasuki, Kanonji, JP;

Assignee:

KANAE TECHNOS CO., LTD., Kanonji-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 69/00 (2006.01); B65D 85/00 (2006.01); A45D 44/00 (2006.01); A61F 13/00 (2006.01); A61F 13/02 (2006.01); B65D 75/20 (2006.01); B65D 75/30 (2006.01); B31B 50/26 (2017.01);
U.S. Cl.
CPC ...
B65D 85/70 (2013.01); A45D 44/002 (2013.01); A61F 13/00076 (2013.01); A61F 13/0276 (2013.01); B31B 50/26 (2017.08); B65D 75/20 (2013.01); B65D 75/30 (2013.01); A45D 2200/1027 (2013.01); A45D 2200/1036 (2013.01); A61F 2013/00646 (2013.01); A61F 2013/0296 (2013.01);
Abstract

[Purpose] The disclosure provides a package structure of an agent for skin external application, which is unfolded upon the opening of the package structure and very easily separated from the stack structure, and a method of fabricating the package structure for the agent for skin external application. [Constitution] An agentfor skin external application is interposed between a film-type base materialand a film-type cover material, the resultant product is folded by employing the cover materialas a folding surface, and the four-layer overlap material including the base material-the cover material-the cover material-the base materialprovided at a peripheral portion of the folded structure is closed through thermal bonding.


Find Patent Forward Citations

Tsujimura, Yasushi. (2018). Package structure for agent for external application and method of fabricating package structure for agent for external application (U.S. Patent No. 9884717). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9884717

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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