The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Sep. 24, 2015
Applicant:

Endress + Hauser Gmbh + Co. KG, Maulburg, DE;

Inventors:

Joachim Albert, Leonberg, DE;

Detlev Wittmer, Maulbronn, DE;

Marc Baret, Kembs, FR;

Thomas Uehlin, Schopfheim, DE;

Dietmar Spanke, Steinen, DE;

Benjamin Mack, Lorrach, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 80/00 (2015.01); B22F 3/105 (2006.01); B33Y 10/00 (2015.01); B33Y 50/00 (2015.01); B29C 64/106 (2017.01); B29C 64/153 (2017.01); B29C 64/112 (2017.01); B29C 64/118 (2017.01); B29C 67/00 (2017.01); B22F 3/11 (2006.01); B22F 7/06 (2006.01);
U.S. Cl.
CPC ...
B33Y 80/00 (2014.12); B22F 3/1055 (2013.01); B22F 3/1103 (2013.01); B22F 7/06 (2013.01); B29C 64/106 (2017.08); B29C 64/112 (2017.08); B29C 64/118 (2017.08); B29C 64/153 (2017.08); B29C 67/0051 (2013.01); B33Y 10/00 (2014.12); B33Y 50/00 (2014.12); B22F 2003/1057 (2013.01); Y02P 10/295 (2015.11);
Abstract

A method for manufacture of at least one component of a field device for determining or monitoring a process variable, wherein the field device is applied in automation technology and is manufactured from at least one material. The method comprises method steps as follows: specifying at least one structure related and/or material related boundary condition of the component and/or a boundary condition relevant for the functionality of the component and/or at least one external boundary condition, which takes into consideration the influence of environmental conditions on the component at the location of use; optimizing the structure of the component via a finite element model taking into consideration the at least one structure related and/or material related boundary condition and/or the at least one boundary condition relevant for the functionality of the component and/or the at least one environmental condition, wherein the optimized structure of the component is described by digital data; transferring the digital data, which describe the optimized structure of the component, to a 3-D printer; and printing the component in accordance with the digital data.


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