The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Aug. 18, 2015
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Daiyu Okafuji, Joetsu, JP;

Hiroyuki Yamazaki, Joetsu, JP;

Masao Ando, Joetsu, JP;

Masaki Takeuchi, Joetsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); B24B 9/06 (2006.01); B29C 33/38 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B24B 9/065 (2013.01); B29C 33/3842 (2013.01); G03F 7/0002 (2013.01); B29K 2909/08 (2013.01);
Abstract

A rectangular substrate is prepared by providing a starting rectangular substrate having front and back surfaces and four side surfaces as ground, and pressing a rotary polishing pad perpendicularly against one side surface under a constant pressure, and relatively moving the rotary polishing pad and the substrate parallel to the side surface, for thereby polishing the side surface of the substrate. In the imprint lithography, the rectangular substrate is capable of controlling compression and pattern shape at a high accuracy and thus transferring a complex pattern of fine feature size to a recipient.


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