The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Aug. 17, 2015
Applicant:

William C. Stumphauzer, Avon, OH (US);

Inventor:

William C. Stumphauzer, Avon, OH (US);

Assignee:

Foammatick, LLC, Naples, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B67D 1/00 (2006.01); B67D 7/14 (2010.01); B67D 7/80 (2010.01); B05B 7/16 (2006.01); B05B 7/00 (2006.01); C09J 7/02 (2006.01); C09J 9/00 (2006.01); C09J 11/06 (2006.01); C08J 9/10 (2006.01); C09J 201/00 (2006.01); G05D 23/19 (2006.01);
U.S. Cl.
CPC ...
B05B 7/168 (2013.01); B05B 7/0025 (2013.01); C08J 9/103 (2013.01); C09J 7/0203 (2013.01); C09J 9/00 (2013.01); C09J 11/06 (2013.01); C09J 201/00 (2013.01); G05D 23/1902 (2013.01); G05D 23/1917 (2013.01); C08J 2400/12 (2013.01);
Abstract

The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.


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