The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Oct. 27, 2015
Applicant:

Semikron Elektronik Gmbh & Co., KG, Nürnberg, DE;

Inventors:

Christian Göbl, Nürnberg, DE;

Heinrich Heilbronner, Stein bei Nürnberg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 3/10 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H01L 23/3121 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 24/50 (2013.01); H01L 24/86 (2013.01); H01L 25/07 (2013.01); H05K 3/10 (2013.01); H01L 23/367 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73269 (2013.01); H01L 2224/8384 (2013.01);
Abstract

A method for producing a power electronic switching device comprising a substrate, having a power semiconductor component arranged thereon; a connection device, and terminal devices. The method comprises: Providing the substrate with an insulation ply and conductor tracks electrically insulated from one another, wherein a power semiconductor component is arranged on a conductor track and is cohesively connected thereto; Arranging the connection device embodied as a film stack; Arranging a thin pressure- and temperature-resistant and moisture-blocking insulation layer along a surface contour of the connection device and comprising a covering section and an overlap section, which overlaps the connection device circumferentially and covers the substrate in a circumferential contact region; Cohesively connecting the connection device to the substrate, whereby the connection device connects the switching device in a circuit-conforming manner internally; Connecting the covering section to the connection device; Connecting the overlap section to the contact region.


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