The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
May. 18, 2015
Kyongsoon Cho, Incheon, KR;
Yungcheol Kong, Cheonan-si, KR;
KyongSoon Cho, Incheon, KR;
Yungcheol Kong, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Provided are semiconductor modules and semiconductor packages. The semiconductor module may include a module substrate and a semiconductor package mounted on the module substrate. The semiconductor package may include a substrate with a top surface and a bottom surface. Here, the top surface of the substrate may be flat and the bottom surface of the substrate may include a first region and a second region positioned at a lower level than the first region. The semiconductor package may further include connecting portions which are provided on the bottom surface of the substrate and electrically connected to the module substrate.