The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Feb. 23, 2016
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Keisuke Sugita, Hitachi, JP;
Akinari Nakayama, Hitachinaka, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01R 13/58 (2006.01); H01R 13/52 (2006.01); H01B 7/282 (2006.01); H01R 4/70 (2006.01);
U.S. Cl.
CPC ...
H01R 13/5845 (2013.01); H01B 7/282 (2013.01); H01R 4/70 (2013.01); H01R 13/5205 (2013.01);
Abstract
A molded electric wire is composed of a conductor wire, an insulating member coating a circumference of the conductor wire, including a thermoplastic polyurethane, and having an arithmetic average surface roughness of not smaller than 5 μm and not greater than 100 μm, and a molded resin part directly coating a terminal of the insulating member.