The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Aug. 19, 2015
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jun Seung Yi, Suwon-si, KR;

Ye Ji Park, Suwon-si, KR;

Sun Hee Lee, Suwon-si, KR;

Hyeon Gil Nam, Suwon-si, KR;

Nam Ki Kim, Suwon-si, KR;

Su Hyun Kim, Suwon-si, KR;

Ha Ryong Hong, Suwon-si, KR;

Sung Eun Cho, Suwon-si, KR;

Dae Seong Jeon, Suwon-si, KR;

Ho Jin Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 9/42 (2006.01); H01Q 5/371 (2015.01); B29L 31/34 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 5/371 (2015.01); H01Q 9/42 (2013.01); B29C 45/14639 (2013.01); B29L 2031/3481 (2013.01);
Abstract

A radiator frame having an antenna radiator formed on a surface thereof and a method of manufacturing the same are provided. The radiator frame includes: a radiator including an antenna pattern portion configured to transmit or receive a signal, and a connection terminal portion configured to electrically connect the antenna pattern portion and a circuit board; and a molding frame connected to the radiator such that the antenna pattern portion is exposed at one surface of the molding frame and the connection terminal portion is exposed at another surface of the molding frame opposing the one surface of the molding frame. The connection terminal portion may include a plated layer exposed at the other surface of the molding frame to contact the circuit board.


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