The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Oct. 08, 2014
Applicant:
Skorpios Technologies, Inc., Albuquerque, NM (US);
Inventors:
Stephen B. Krasulick, Albuquerque, NM (US);
John Dallesasse, Geneva, IL (US);
Amit Mizrahi, Albuquerque, NM (US);
Timothy Creazzo, Albuquerque, NM (US);
Elton Marchena, Albuquerque, NM (US);
John Y. Spann, Albuquerque, NM (US);
Assignee:
Skorpios Technologies, Inc., Albuquerque, NM (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/102 (2006.01); H01L 31/0232 (2014.01); H01S 5/022 (2006.01); H01S 5/026 (2006.01); H01S 5/30 (2006.01); H01S 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); H01S 5/026 (2013.01); H01S 5/02248 (2013.01); H01S 5/02268 (2013.01); H01S 5/02272 (2013.01); H01S 5/3013 (2013.01); H01S 5/021 (2013.01); H01S 5/02252 (2013.01);
Abstract
A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.