The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Jul. 01, 2016
Applicant:

Sunpower Corporation, San Jose, CA (US);

Inventors:

Matthieu Moors, Braine-le-Chateau, BE;

Markus Nicht, Hohenbrunn, DE;

Daniel Maria Weber, Augsburg, DE;

Rico Bohme, Rochlitz, DE;

Mario Gjukic, Munich, DE;

Gabriel Harley, Mountain View, CA (US);

Mark Kleshock, Phoenix, AZ (US);

Mohamed A. Elbandrawy, Danville, CA (US);

Taeseok Kim, San Jose, CA (US);

Assignees:

SunPower Corporation, San Jose, CA (US);

Total Marketing Services, Puteaux, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0224 (2006.01); H01L 31/05 (2014.01); H01L 31/028 (2006.01); H01L 31/18 (2006.01); H01L 31/0368 (2006.01); H01L 31/0745 (2012.01); H01L 31/0236 (2006.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 31/022441 (2013.01); H01L 31/028 (2013.01); H01L 31/02168 (2013.01); H01L 31/02363 (2013.01); H01L 31/03682 (2013.01); H01L 31/0745 (2013.01); H01L 31/18 (2013.01); H01L 31/1864 (2013.01); H01L 31/022433 (2013.01); H01L 31/0512 (2013.01); H01L 31/0516 (2013.01);
Abstract

Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a semiconductor region can be formed in or above a substrate. A first metal layer can be formed over the semiconductor region. A laser can be applied over a first region of the metal layer to form a first metal weld between the metal layer and the semiconductor region, where applying a laser over the first region comprises applying the laser at a first scanning speed. Subsequent to applying the laser over the first region, the laser can be applied over a second region of the metal layer where applying the laser over the second region includes applying a laser at a second scanning speed. Subsequent to applying the laser over the second region, the laser can be applied over a third region of the metal layer to form a second metal weld, where applying the laser over the third region comprises applying the laser at a third scanning speed.


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