The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Jul. 02, 2013
Applicant:
Rfhic Corporation, Anyang-si, KR;
Inventors:
Quentin Diduck, Santa Clara, CA (US);
Daniel Francis, Santa Clara, CA (US);
Frank Yantis Lowe, Santa Clara, CA (US);
Felix Ejeckham, Santa Clara, CA (US);
Assignee:
RFHIC Corporation, Anyang-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 29/16 (2006.01); H01L 21/683 (2006.01); H01L 29/165 (2006.01); H01L 23/373 (2006.01); H01L 21/20 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1602 (2013.01); H01L 21/02002 (2013.01); H01L 21/2007 (2013.01); H01L 21/6835 (2013.01); H01L 23/3732 (2013.01); H01L 24/29 (2013.01); H01L 24/98 (2013.01); H01L 29/165 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68381 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24355 (2015.01);
Abstract
Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers () to a carrier () are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.