The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Nov. 27, 2014
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Hidetsugu Otani, Kumamoto, JP;

Yuuji Kishigami, Kumamoto, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14643 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 27/14689 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/03602 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/94 (2013.01);
Abstract

The present technology relates to a semiconductor apparatus, a solid state imaging device, an imaging apparatus and electronic equipment which realize a smaller and thinner size and which enable improvement of optical characteristics, and a manufacturing method thereof. A side electrodeis formed on a side face of a substrate on which an imaging deviceis formed. By this side electrodebeing connected to an electrode padon the substratethrough a chip wiringformed with solder, the imaging deviceis electrically connected to the substrate. By this means, because it is possible to electrically connect the imaging deviceto the substratewithout using wire bonding, space required for wire bonding is not required, so that it is possible to realize a smaller and thinner apparatus. The present technology can be applied to an imaging apparatus.


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