The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Jun. 20, 2016
Applicant:
Epistar Corporation, Hsinchu, TW;
Inventors:
Hsu-Cheng Lin, Hsinchu, TW;
Pei-Shan Fang, Hsinchu, TW;
Ching-Yi Chiu, Hsinchu, TW;
Chun-Chang Chen, Hsinchu, TW;
Assignee:
EPISTAR CORPORATION, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 31/00 (2006.01); H01L 25/075 (2006.01); H01L 21/82 (2006.01); H01L 27/15 (2006.01); H01L 27/14 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01); H01L 31/048 (2014.01); H01L 31/18 (2006.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/82 (2013.01); H01L 22/22 (2013.01); H01L 23/544 (2013.01); H01L 27/14 (2013.01); H01L 27/15 (2013.01); H01L 31/048 (2013.01); H01L 31/1876 (2013.01); H01L 33/0054 (2013.01); H01L 33/54 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68354 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01);
Abstract
An aggregation of semiconductor devices comprises a first layer, a second layer adhered to the first layer, and a plurality of semiconductor devices arranged between the first layer and the second layer to form a shape, wherein the shape comprises a curve and a mark, and the first layer is flexible.