The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Aug. 30, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Boe Optoelectronics Technology Co., Ltd., Anhui, CN;

Inventor:

Guangyuan Cai, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 23/00 (2006.01); B32B 43/00 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/799 (2013.01); B32B 37/0053 (2013.01); B32B 43/006 (2013.01); B32B 38/10 (2013.01); B32B 2457/20 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75822 (2013.01); H01L 2224/7999 (2013.01); H01L 2924/0781 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1911 (2015.01); Y10T 156/1944 (2015.01);
Abstract

The present disclosure provides an apparatus for removing a chip, including: a loading station; a heating head arranged to soften an anisotropic conductive film on a substrate of a display panel for fixing the chip; a base table arranged on the loading station and arranged to support the display panel; and a base seat arranged on the loading station and arranged to support the heating head, wherein the heating head is rotatably mounted onto the base seat and the heating head has a rotation axis perpendicular to a surface of the loading station facing towards the base table. With the above apparatus, the face of the heating head facing towards the chip contacts with the face of the chip facing towards the heating head more sufficiently. The force to which the portion of the chip is subject is reduced and the force applied to the chip becomes more uniform.


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