The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Oct. 04, 2016
Applicant:
Olympus Corporation, Tokyo, JP;
Inventor:
Kazuaki Kojima, Suwa, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 3/36 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/4857 (2013.01); H01L 23/4985 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49894 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 27/14636 (2013.01); H05K 3/363 (2013.01); H05K 3/4691 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/50 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12043 (2013.01); H05K 2201/068 (2013.01);
Abstract
A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.