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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9881846 B1

PDFFull Text
Date of Patent:
Jan. 30, 2018

Filed:

Sep. 01, 2016

Semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventor:

Takafumi Yamada, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-shi, Kanagawa, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
H01L 23/22 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01); H01L 23/24 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/488 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 23/24 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/488 (2013.01); H01L 23/5386 (2013.01); H01L 25/072 (2013.01); H01L 27/0255 (2013.01); H01L 27/0647 (2013.01); H01L 23/36 (2013.01);
Abstract

A semiconductor device includes: a semiconductor element; a laminated substrate including an insulating plate and a circuit board which is arranged on the front surface of the insulating plate and on which the semiconductor element is arranged; a lead terminal provided via solder in a major electrode of the front surface of the semiconductor element; and a sealing resin for sealing the semiconductor element, the laminated substrate, and the lead terminal, wherein a value of 'Young's modulus of the sealing resin×(linear expansion coefficient of the lead terminal−linear expansion coefficient of the sealing resin)' is equal to or greater than −26×10(Pa/° C.) and equal to or less than 50×10(Pa/° C.).

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