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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9880594 B1

PDFFull Text
Date of Patent:
Jan. 30, 2018

Filed:

Jul. 27, 2015

Thermal management for solid-state drive

Applicant:

Western Digital Technologies, Inc., Irvine, CA (US);

Inventors:

Richard A. Mataya, Rancho Santa Margarita, CA (US);

Tegan Campbell, Dana Point, CA (US);

Assignee:

Western Digital Technologies, Inc., San Jose, CA (US);

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Marvin Payen

Int. Cl.
CPC ...
H01L 23/34 (2006.01); G06F 1/20 (2006.01); H01L 23/373 (2006.01); B82Y 10/00 (2011.01); G06F 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); B82Y 10/00 (2013.01); G06F 1/18 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/373 (2013.01); H05K 1/0206 (2013.01); H05K 1/181 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 23/49855 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H05K 2201/10159 (2013.01); Y10S 977/734 (2013.01); Y10S 977/932 (2013.01);
Abstract

A device structure includes a printed circuit board (PCB) comprising a thermal conduction plane, at least one heat generating component thermally connected to the thermal conduction plane, and a first frame portion thermally connected to the thermal conduction plane and at least partially enclosing the at least one heat generating component. The thermal conduction plane thermally connects the at least one heat generating component to the first frame portion by way of a plurality of vias from a surface of the PCB to the thermal conduction plane.

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