The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Nov. 11, 2014
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 19/35 (2010.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01F 17/00 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
G01S 19/35 (2013.01); H01L 23/645 (2013.01); H01L 24/14 (2013.01); H01F 17/0006 (2013.01); H01L 28/10 (2013.01); H01L 2224/14132 (2013.01);
Abstract
A semiconductor device includes: a substrate; a first layer that is stacked on the substrate and includes an inductor; and a bump group that is arranged above the first layer, wherein the bump group includes a plurality of bumps that are arranged under a predetermined rule, and at least one bump that is different from the plurality of bumps and whose center does not overlap the inductor when the semiconductor device is viewed in a plan view from a direction vertical to a plane on which the bump group is provided.