The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Nov. 11, 2015
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Teruo Takizawa, Matsumoto, JP;

Atsuki Naruse, Shiojiri, JP;

Shigekazu Takagi, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/00 (2006.01); G01C 19/5769 (2012.01); G01C 19/5712 (2012.01); G01P 15/125 (2006.01); G01P 15/08 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01C 19/5769 (2013.01); B81C 1/00301 (2013.01); G01C 19/5712 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); G01P 2015/0814 (2013.01);
Abstract

A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.


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