The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Dec. 09, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Gary Austin Lamberton, Glenville, NY (US);

Curtis Wayne Rose, Mechanicville, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/07 (2006.01); G01B 17/02 (2006.01); G01M 5/00 (2006.01); G01N 29/04 (2006.01); G01N 29/44 (2006.01); F03D 17/00 (2016.01);
U.S. Cl.
CPC ...
G01B 17/02 (2013.01); F03D 17/00 (2016.05); G01M 5/0016 (2013.01); G01N 29/043 (2013.01); G01N 29/07 (2013.01); G01N 29/4427 (2013.01); G01N 2291/02854 (2013.01); G01N 2291/048 (2013.01); G01N 2291/103 (2013.01); G01N 2291/2675 (2013.01); G01N 2291/2693 (2013.01);
Abstract

A method of inspecting a connection joint including a first side coupled to an opposite second side along a bond, extending along an edge. The method includes generating at least one first sound wave at a first location on the first side, wherein the first location is at a first distance from the edge. The method also includes receiving the at least one first sound wave at a plurality of sensors coupled to the second side and determining that the bond is present at the first location. The method further includes generating at least one second sound wave at a second location on the first side, wherein the second location is offset a predetermined distance from the first location. The method also includes receiving the at least one second sound wave at the plurality of sensors and determining a width of the bond.


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