The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

May. 29, 2014
Applicant:

H.b. Fuller Company, St. Paul, MN (US);

Inventors:

Peter Remmers, Hamburg, DE;

Dirk Laukien, Radbruch, DE;

Lynne Purvis, Viborg, DK;

Nicholas Porro, Wilmington, DE (US);

Nicholas Taylor, Oakwood, GB;

Assignee:

H.B. Fuller Company, St. Paul, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/02 (2006.01); B65G 19/18 (2006.01); C09J 7/02 (2006.01); A61L 15/22 (2006.01); A61L 31/04 (2006.01); A61L 15/58 (2006.01); A61L 31/14 (2006.01); B32B 27/30 (2006.01); B32B 1/08 (2006.01); B32B 27/18 (2006.01); B32B 27/22 (2006.01); B32B 27/32 (2006.01); B65G 27/00 (2006.01); D06N 3/00 (2006.01); D06N 3/04 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
B32B 1/02 (2013.01); A61L 15/225 (2013.01); A61L 15/585 (2013.01); A61L 31/041 (2013.01); A61L 31/14 (2013.01); B32B 1/08 (2013.01); B32B 27/18 (2013.01); B32B 27/22 (2013.01); B32B 27/30 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/325 (2013.01); B32B 27/327 (2013.01); B65G 19/18 (2013.01); B65G 27/00 (2013.01); C09J 5/06 (2013.01); C09J 7/0221 (2013.01); C09J 7/0275 (2013.01); D06N 3/0011 (2013.01); D06N 3/0086 (2013.01); D06N 3/045 (2013.01); C09J 2201/61 (2013.01); C09J 2423/003 (2013.01); D06N 2203/042 (2013.01); D06N 2205/06 (2013.01); D06N 2209/16 (2013.01); D10B 2509/00 (2013.01); D10B 2509/026 (2013.01); Y10T 428/1334 (2015.01); Y10T 428/1341 (2015.01); Y10T 428/1352 (2015.01); Y10T 428/1379 (2015.01); Y10T 428/23 (2015.01); Y10T 428/28 (2015.01); Y10T 428/2967 (2015.01); Y10T 442/2754 (2015.04);
Abstract

The present invention relates to a packaged hot-melt pressure sensitive adhesive comprising a hot-melt pressure sensitive adhesive composition and a coextrusion coating consisting of neat low density polyethylene, neat polypropylene, or neat ethylene vinyl acetate. The present invention further relates to the use of the packaged adhesive formed as individual forms in an adhesive application process, and the use of the packaged adhesive in the production of laminated articles, including nonwoven hygiene articles, disposable medical drapes, and also laminate constructions such as tapes and labels.


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