The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Dec. 05, 2014
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Shogo Kawamura, Kawasaki, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/02 (2006.01); B29C 45/00 (2006.01); B29C 45/16 (2006.01); B29K 101/10 (2006.01); B29L 22/00 (2006.01); B29C 45/17 (2006.01);
U.S. Cl.
CPC ...
B29C 45/02 (2013.01); B29C 45/16 (2013.01); B29C 45/1759 (2013.01); B29K 2101/10 (2013.01); B29L 2022/00 (2013.01); Y10T 428/1397 (2015.01);
Abstract
There is provided a molding method for efficiently and accurately molding a hollow part of a thermosetting resin with a simple mechanism, a mold, and a molded article. A mold used for molding of a thermosetting resin includes an upper mold, an intermediate mold, and a lower mold which can be stacked with each other. Primary molding for molding segment parts and secondary molding for bonding the segment parts are sequentially performed by placing or retracting the intermediate mold to switch between a runner for primary molding and a runner for secondary molding.