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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9878472 B1

PDFFull Text
Date of Patent:
Jan. 30, 2018

Filed:

Feb. 04, 2013

Method for fabricating ultra-low density three-dimensional thin film structure based on photo-lithography

Applicant:

Industry Foundation of Chonnam National University, Gwangju, KR;

Inventors:

Ki Ju Kang, Jeollanam-do, KR;

Seung Cheul Han, Gwangju, KR;

Min Geun Lee, Jeollabuk-do, KR;

Assignee:

INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY, Gwangju, KR;

Attorney:

Paratus Law Group, PLLC

Primary Examiner:

Kathleen Duda

Int. Cl.
CPC ...
G03F 7/20 (2006.01); B29C 41/00 (2006.01); B29C 35/02 (2006.01); B29C 35/08 (2006.01); G03F 7/00 (2006.01); B22C 9/12 (2006.01); B22C 9/22 (2006.01); B22D 25/02 (2006.01); B28B 1/30 (2006.01); B28B 11/12 (2006.01); B29C 41/02 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 41/003 (2013.01); B22C 9/12 (2013.01); B22C 9/22 (2013.01); B22D 25/02 (2013.01); B28B 1/30 (2013.01); B28B 11/12 (2013.01); B29C 35/0266 (2013.01); B29C 35/0805 (2013.01); B29C 35/0888 (2013.01); B29C 35/0894 (2013.01); B29C 41/02 (2013.01); G03F 7/0035 (2013.01); G03F 7/0037 (2013.01); B29C 2035/0827 (2013.01); B29L 2031/757 (2013.01); B29L 2031/772 (2013.01);
Abstract

A method for forming an ultra-low density three-dimensional thin film structure made of a solid thin film, including: radiating ultraviolet rays of different patterns in respective predetermined directions to a liquid photosensitive resin bulk so as to harden a portion of the resin bulk; removing the liquid photosensitive resin which is not hardened so as to form a solid photosensitive resin structure; coating the surface of the solid photosensitive resin structure with a thin film; removing the thin film from the outermost surface of the resin bulk so as to expose the solid photosensitive resin; and removing the solid photosensitive resin structure.

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