The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Mar. 07, 2014
Fuji Machine Mfg. Co., Ltd., Chiryu, JP;
Akihiro Senga, Okazaki, JP;
Yasunori Kamegai, Owariasahi, JP;
FUJI MACHINE MFG. CO., LTD., Chiryu, JP;
Abstract
A solder supply device provided with solder cuphousing liquid solder that is cylindrical and open at one end, and supply nozzlethat is inserted into the solder cup, that supplies solder from inside the solder cup by moving the solder cup by supplying air to space, wherein a fixed amount of air is supplied in a case in which the solder cup movement distance is less than a specified distance, and a greater amount of air than the above specified amount is supplied in a case in which the solder cup movement distance is the set movement distance or greater. That is, when supplying solder, in a case in which the volume of the space to which air is supplied is a specified volume or greater, a greater amount of air is supplied than the air supply amount for when the volume of the space is a specified volume or less. Thus, even in a case in which the volume of the space is equal to or greater than the specified volume, it is possible to supply the same amount of solder as the solder supply volume in a case in which the volume of the space is less than the specified volume, thus it is possible to control operation of the solder supply device considering differential head.