The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

May. 26, 2016
Applicant:

Delta Electronics Int'l (Singapore) Pte Ltd, Singapore, SG;

Inventors:

Chad-Yao Tan, Singapore, SG;

Da-Jung Chen, Singapore, SG;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 25/07 (2006.01); H02M 7/00 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20254 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 25/07 (2013.01); H02M 7/003 (2013.01); H05K 7/20927 (2013.01); H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01L 2023/4018 (2013.01); H01L 2023/4043 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A package assembly includes a housing frame, a power module, a first heat dissipating module and a second heat dissipating module. The housing frame is fixed on the first heat dissipating module. The power module is disposed within a hollow part of the housing frame, and covers a first open end of the hollow part. The power module includes a first surface, a second surface and at least one pin. The first surface has a periphery region and a middle region. The second surface is attached on the first heat dissipating module. The at least one pin is disposed on the periphery region. The at least one pin is penetrated through the corresponding opening and partially exposed outside the housing frame. The second heat dissipating module is disposed within the hollow part and attached on the middle region of the first surface of the power module.


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Tan, Chad-Yao. (2018). Package assembly (U.S. Patent No. 9877408). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9877408

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