The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Dec. 24, 2014
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Michiaki Nishimura, Higashine, JP;

Assignee:

KYOCERA Corporation, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 2/06 (2006.01); H01K 1/18 (2006.01); H05K 1/18 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01G 4/232 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01G 2/06 (2013.01); H01G 4/12 (2013.01); H01G 4/228 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/111 (2013.01); H05K 1/0271 (2013.01); H05K 3/305 (2013.01); H05K 3/321 (2013.01); H05K 3/3442 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/10015 (2013.01); Y02P 70/611 (2015.11);
Abstract

A laminated electronic component includes a main body composed of a stacked body in which dielectric layers and internal electrode layers are alternately laminated, and an external electrode disposed on an outer surface of the stacked body so as to make electrical connection with the internal electrode layers; and a first joining member and a second joining member which are provided on a first face side located in a stacking direction of the dielectric layers and the inner electrode layers. The first joining member and the second joining member are provided on a first side and second side which constitute the first face, respectively, and located in a region which includes midpoints thereof but does not include a vertex of the main body. By mounting such a laminated electronic component to a substrate via the joining members, acoustic noise can be suppressed.


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