The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Apr. 28, 2016
Murata Manufacturing Co., Ltd., Kyoto, JP;
Kazuhiko Takemura, Kyoto, JP;
Kazuhiro Isebo, Kyoto, JP;
Yutaka Fukuda, Kyoto, JP;
Yoshikazu Oikawa, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A multilayer substrate including a multilayer body formed by laminating a plurality of insulating layers including via holes in the insulating layer as an uppermost layer of the multilayer body so as to pass through the insulating layer, and via conductors formed by filling the via holes with a conductive paste. The via holes are formed through lower end positions, upper end positions, and intermediate positions between the lower end positions and the upper end positions such that a diameter enlargement degree toward the upper end positions from the intermediate positions is larger than a diameter enlargement degree toward the intermediate positions from the lower end positions. By forming the via holes as described above, when the via holes are filled with the conductive paste from openings at the small diameter side of the via holes, exudation of the conductive paste from openings at the large diameter side is prevented.