The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Mar. 26, 2014
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Satoshi Kajita, Kyoto, JP;

Mitsuhiro Hagihara, Kyoto, JP;

Yuuhei Matsumoto, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 1/0298 (2013.01); H05K 1/036 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/421 (2013.01); H05K 3/4655 (2013.01); H05K 3/0038 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0266 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/09863 (2013.01); H05K 2201/2072 (2013.01);
Abstract

A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.


Find Patent Forward Citations

Loading…