The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9876149 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 23, 2018

Filed:

Apr. 20, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jae Jun Bang, Hwaseong-si, KR;

Young Kyung Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21S 4/00 (2016.01); F21V 21/00 (2006.01); H01L 33/50 (2010.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); H01L 33/46 (2013.01); H01L 33/508 (2013.01);
Abstract

A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.


Find Patent Forward Citations

Bang, Jae. (2018). Semiconductor light emitting device package and light source module using same (U.S. Patent No. 9876149). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9876149

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