The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Sep. 30, 2014
Applicant:
Aledia, Grenoble, FR;
Inventors:
Christophe Bouvier, Grenoble, FR;
Erwan Dornel, Fontaine, FR;
Assignee:
Aledia, Grenoble, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/24 (2010.01); H01L 33/08 (2010.01); H01L 33/00 (2010.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 33/32 (2010.01); H01L 33/20 (2010.01); H01L 33/18 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/24 (2013.01); H01L 21/0254 (2013.01); H01L 21/02458 (2013.01); H01L 21/02603 (2013.01); H01L 29/0676 (2013.01); H01L 33/005 (2013.01); H01L 33/007 (2013.01); H01L 33/08 (2013.01); H01L 33/18 (2013.01); H01L 33/20 (2013.01); H01L 33/32 (2013.01); H01L 33/38 (2013.01);
Abstract
An optoelectronic device including a support having a first face; a first set of first light-emitting diodes having first wire-like, conical or frustoconical semiconductor elements, each resting on a second face of a first contact stud, each first contact stud including, in addition, a third face opposite the second face; and a first conductive layer connecting the first contact studs and extending at least over part of the second face or the third face of each first contact stud, the first conductive layer and/or the first contact studs resting on the support.