The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Jul. 15, 2014
Applicants:

David J. Meyer, Fairfax, VA (US);

Brian P. Downey, Alexandria, VA (US);

Inventors:

David J. Meyer, Fairfax, VA (US);

Brian P. Downey, Alexandria, VA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 29/20 (2006.01); H01L 29/16 (2006.01); H01L 21/762 (2006.01); H01L 21/78 (2006.01); H01L 21/3213 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/32134 (2013.01); H01L 21/32135 (2013.01); H01L 21/6835 (2013.01); H01L 21/76256 (2013.01); H01L 21/7806 (2013.01); H01L 21/7813 (2013.01); H01L 29/2003 (2013.01); H01L 2221/68368 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method to remove epitaxial semiconductor layers from a substrate by growing an epitaxial sacrificial layer on the substrate where the sacrificial layer is a transition metal nitride (TMN) or a TMN ternary compound, growing one or more epitaxial device layers on the sacrificial layer, and separating the device layers from the substrate by etching the sacrificial layer to completely remove the sacrificial layer without damaging or consuming the substrate or any device layer. Also disclosed are the related semiconductor materials made by this method.


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