The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9876066 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 23, 2018

Filed:

May. 14, 2013
Applicant:

Nanyang Technological University, Singapore, SG;

Inventors:

Qing Zhang, Singapore, SG;

Pingqi Gao, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 21/683 (2006.01); B82Y 30/00 (2011.01); B82Y 10/00 (2011.01); H01L 27/28 (2006.01); H01L 51/52 (2006.01); H01L 51/00 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3274 (2013.01); B82Y 10/00 (2013.01); B82Y 30/00 (2013.01); H01L 21/6835 (2013.01); H01L 27/283 (2013.01); H01L 27/3276 (2013.01); H01L 51/0013 (2013.01); H01L 51/0097 (2013.01); H01L 51/5237 (2013.01); H01L 51/5246 (2013.01); H01L 51/0048 (2013.01); H01L 51/0558 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68386 (2013.01); H01L 2227/323 (2013.01); H01L 2251/5338 (2013.01); H01L 2924/0002 (2013.01); Y02E 10/549 (2013.01);
Abstract

In various embodiments, a method for forming a device may be provided. The method may include forming a contact layer at least partially on a substrate. The method may also include forming a device structure adhered to the contact layer. In addition, the method may include depositing a transfer medium such that the device structure is at least partially covered by the transfer medium. The method may further include solidifying the transfer medium. The method may also include separating the contact layer, the device structure and the transfer medium from the substrate. The contact layer may have a greater adhesion to the device structure than to the substrate.


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Zhang, Qing. (2018). Device and structure and method for forming the same (U.S. Patent No. 9876066). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9876066

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