The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Jun. 06, 2016
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Jin Ho Baek, Icheon-si, KR;
Il Park, Icheon-si, KR;
Ho Kyoon Lee, Icheon-si, KR;
Young Pyo Joo, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06562 (2013.01); H05K 2201/09027 (2013.01);
Abstract
A stack chip package may include a plurality of stacked semiconductor chips. Each of the semiconductor chips may have a first node, a second node, a third node and a fourth node corresponding to corners of the semiconductor chip. The plurality of semiconductor chips may be sequentially stacked such that, when a semiconductor chip is disposed directly on another semiconductor chip, the first node of the semiconductor chip is positioned over a side between the first node and the second node of the another semiconductor chip.