The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Feb. 18, 2016
SK Hynix Inc., Gyeonggi-do, KR;
Chang-Ki Baek, Gyeonggi-do, KR;
Joon-Woo Choi, Gyeonggi-do, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A multi-chip package may include a plurality of semiconductor chips integrated in a single package and sharing one or more command pins. Each of the semiconductor chips may include: a command decoder suitable for decoding a command to generate a buffer enable signal, a mode enable signal, and a mode signal; a data input buffer suitable for buffering data to output internal data, in response to the buffer enable signal and a common test mode signal; a command controller suitable for receiving the mode enable signal to output a test mode enable signal by selectively blocking the mode enable signal based on the internal data and the common test mode signal; and a test controller suitable for generating the common test mode signal and a test mode signal, based on the test mode enable signal and the mode signal.