The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
An embodiment includes a semiconductor package comprising: a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted on a top surface of the first semiconductor chip; a connecting bump disposed between the first and second semiconductor chips to electrically connect the second semiconductor chip to the first semiconductor chip; and a first heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip.
Heo, Junyeong. (2018). Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same (U.S. Patent No. 9875992). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9875992
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
