The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Mar. 16, 2016
Applicant:
Delta Electronics, Inc., Taoyuan, TW;
Inventors:
Assignee:
DELTA ELECTRONICS, INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/565 (2013.01); H01L 23/4334 (2013.01); H01L 23/49531 (2013.01); H01L 23/49575 (2013.01); H01L 25/0657 (2013.01); H01L 23/3121 (2013.01); H01L 23/49555 (2013.01);
Abstract
A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.