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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9875974 B1

PDFFull Text
Date of Patent:
Jan. 23, 2018

Filed:

Mar. 06, 2014

Processing techniques for silicon-based transient devices

Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

John A. Rogers, Champaign, IL (US);

SukWon Hwang, Urbana, IL (US);

Xian Huang, Urbana, IL (US);

Assignee:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Attorney:

Lathrop Gage LLP

Primary Examiner:

Richard Booth

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/8238 (2006.01); H01L 21/28 (2006.01); H01L 21/306 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 21/84 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); G01N 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/28 (2013.01); H01L 21/30604 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 21/768 (2013.01); H01L 21/78 (2013.01); H01L 21/8238 (2013.01); H01L 21/84 (2013.01); H01L 23/53257 (2013.01); H01L 24/96 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); G01N 27/22 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/13091 (2013.01);
Abstract

Provided are methods of making a transient electronic device by fabricating one or more inorganic semiconductor components, one or more metallic conductor components or one or more inorganic semiconductor components and one or more metallic conductor components supported by a mother substrate. The components may independently comprise a selectively transformable material and, optionally, further have a preselected transience profile. The components are transfer printed, thereby decoupling the component fabrication step from additional processing to provide desired device functionality and transient properties. A substrate layer is provided on top of the components and used to facilitate handling, processing, and/or device functionality.

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