The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Mar. 10, 2016
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventor:
Kenji Okamoto, Hachioji, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); H01L 23/043 (2006.01); H01L 23/13 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/043 (2013.01); H01L 23/13 (2013.01); H01L 23/3677 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 25/07 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A power conversion device includes a heat releasing heatsink, a printed circuit board provided on the heatsink and having a through hole and wires, a metal case having a depressed portion fitted in the through hole and mounted on a top of the heatsink, and a heat releasable insulating layer made of a ceramic material and disposed between a bottom of the depressed portion and a top portion of the heat sink. A power semiconductor element is mounted in the depressed portion and electrically connected to the wires of the printed circuit board.