The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Mar. 15, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Friedrich Rasbornig, Klagenfurt, AT;

Mario Motz, Wernberg, AT;

Wolfgang Scherr, Villach, AT;

Wolfgang Granig, Seeboden, AT;

Michael Strasser, Villach, AT;

Bernhard Schaffer, Villach, AT;

Gerhard Pircher, Villach, AT;

Ferdinand Gastinger, Woelfnitz, AT;

Dirk Hammerschmidt, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/3187 (2006.01); B60T 8/88 (2006.01); G01D 3/08 (2006.01); B60W 50/02 (2012.01); G01R 31/00 (2006.01); G01R 31/28 (2006.01); B60W 50/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/3187 (2013.01); B60T 8/885 (2013.01); B60W 50/0205 (2013.01); G01D 3/08 (2013.01); B60T 2250/06 (2013.01); B60T 2270/406 (2013.01); B60T 2270/411 (2013.01); B60T 2270/413 (2013.01); B60W 2050/0047 (2013.01); B60W 2050/0215 (2013.01); G01R 31/007 (2013.01); G01R 31/2829 (2013.01);
Abstract

Embodiments relate to systems and methods for self-diagnostics and/or error detection using multiple signal paths in sensor and other systems. In an embodiment, a sensor system comprises at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second DSP. A signal from the first DSP can be compared with a signal from the second DSP, either on-chip or off, to detect faults, errors, or other information related to the operation of the sensor system. Embodiments of these systems and/or methods can be configured to meet or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.


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