The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Apr. 01, 2015
Applicants:

Epistar Corporation, Science-based Industrial Park, TW;

Interlight Optotech Corporation, Yangmei, TW;

Inventors:

Hwa Su, Yangmei, TW;

Tzu Chi Cheng, Yangmei, TW;

Hong Zhi Liu, Yangmei, TW;

Yu Min Li, Yangmei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 99/00 (2016.01); H01L 25/075 (2006.01); F21K 9/232 (2016.01); F21K 9/64 (2016.01); F21K 9/90 (2016.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); F21Y 101/00 (2016.01);
U.S. Cl.
CPC ...
F21K 9/56 (2013.01); F21K 9/232 (2016.08); F21K 9/64 (2016.08); H01L 25/0753 (2013.01); F21K 9/90 (2013.01); F21Y 2101/00 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An LED assembly, comprising: a light-transmissive substrate comprising a surface, a central region and a peripheral region surrounding the central region; a heat dissipation element, wherein a portion of the heat dissipation element is corresponding to the central region of the light-transmissive substrate; a first wavelength conversion layer arranged on the surface of the light-transmissive substrate and corresponding to the peripheral region of the light-transmissive substrate; a plurality of LED elements arranged on the first wavelength conversion layer; a second wavelength conversion layer arranged on the surface of the light-transmissive substrate and covering the plurality of LED elements and the first wavelength conversion layer; a plurality of conductive structures surrounding the plurality of LED elements and electrically connected thereto, wherein the plurality of conductive structures is formed on the surface and separated from each other; and a plurality of electrical contacts electrically connected to the plurality of conductive structures respectively.


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