The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Aug. 29, 2014
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Sumikazu Ogata, Tokyo, JP;
Shigeki Tokuchi, Saitama, JP;
Yohei Maruyama, Saitama, JP;
Motomi Oshika, Saitama, JP;
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Abstract
A polishing material including polishing abrasive grains, the polishing abrasive grain having a core material that includes a metal oxide, and a cover layer that is provided on a surface of the core material and includes an oxide of a metal, that is different from the core material, or an oxide of a semimetal. When the polishing abrasive grains are observed with a scanning electron microscope after boiling a slurry including the polishing abrasive grains for 5 hours, a ratio of a longitudinal axis to a lateral axis of the polishing abrasive grain is 1.0 or greater and less than 1.5. The polishing abrasive grain preferably has a mass ratio of the cover layer to the core material, cover layer/core material, of from 0.3 mass % to 30 mass % inclusive. The cover layer preferably has a thickness of from 0.2 nm to 500 nm inclusive.