The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Aug. 28, 2014
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Atsushi Masunaga, Nagoya, JP;

Hideyuki Umetsu, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/02 (2006.01); C08L 63/00 (2006.01); C08L 77/06 (2006.01); C08G 69/48 (2006.01); C08L 77/02 (2006.01); C08J 3/00 (2006.01); C08K 5/053 (2006.01); C08K 5/15 (2006.01); C08K 5/29 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); C08G 69/48 (2013.01); C08J 3/005 (2013.01); C08L 77/02 (2013.01); C08J 2377/02 (2013.01); C08J 2377/06 (2013.01); C08J 2463/02 (2013.01); C08J 2463/04 (2013.01); C08J 2479/00 (2013.01); C08K 5/053 (2013.01); C08K 5/15 (2013.01); C08K 5/29 (2013.01); C08L 2201/08 (2013.01);
Abstract

A polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130° C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.2 mm after the heat treatment is lower than 70%.


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