The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Feb. 16, 2017
Applicant:

Novoset, Llc, Peapack, NJ (US);

Inventors:

Sajal Das, Bedminster, NJ (US);

Christopher N. Das, Bedminster, NJ (US);

Patrick Shipman, Stirling, NJ (US);

Benjamin G. Baxter, Far Hills, NJ (US);

Assignee:

Novoset, LLC, Peapack, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C08G 59/14 (2006.01); C08G 73/12 (2006.01); C08G 63/91 (2006.01); B33Y 70/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
C08G 59/1477 (2013.01); B33Y 70/00 (2014.12); C08G 63/91 (2013.01); C08G 73/128 (2013.01); B33Y 80/00 (2014.12);
Abstract

A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.


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