The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Aug. 05, 2013
Applicant:
Hosiden Corporation, Yao-shi, JP;
Inventors:
Takeshi Isoda, Yao, JP;
Koji Shinoda, Yao, JP;
Assignee:
HOSIDEN CORPORATION, Yao-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); B29C 45/14 (2006.01); H05K 13/04 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 7/00 (2013.01); B29C 45/14467 (2013.01); B29C 45/14639 (2013.01); H05K 13/04 (2013.01); H01L 21/4846 (2013.01); H01L 21/565 (2013.01); H01L 23/13 (2013.01); H01L 23/3107 (2013.01); H01L 23/49861 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/4913 (2015.01);
Abstract
The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.