The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Aug. 17, 2016
Applicant:
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Inventors:
James David Holbery, Bellevue, WA (US);
Siyuan Ma, Bothell, WA (US);
Michael David Dickey, Redmond, WA (US);
Andrew L. Fassler, Pittsburgh, PA (US);
Assignee:
MICROSOFT TECHNOLOGY LICENSING, LLC, Redmond, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); H01R 4/58 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/14 (2013.01); H05K 1/0296 (2013.01); H05K 1/0393 (2013.01); H05K 3/107 (2013.01); H05K 3/28 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/1305 (2013.01);
Abstract
One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.