The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Jun. 13, 2016
Copper clad laminate, printed circuit board including the same, and manufacturing method of the same
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Seung Woo Choi, Seoul, KR;
Sung Cheul Jeong, Gyeonggi-do, KR;
Ho Sub Kim, Seoul, KR;
Young Do Kim, Daejeon, KR;
Cheol Ho Kim, Chungcheongbuk-do, KR;
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Abstract
Disclosed is a flexible copper clad laminate including a first copper foil layer, a composite layer, and a second copper foil layer. Preferably, the composite layer includes a polyimide layer and a plurality of thermoplastic polyimide layers as an outermost layer thereof being the thermoplastic polyimide layers. In particular, with respect to a total thickness of the composite layer, a total thickness of the plurality of thermoplastic polyimide layers is in a range of from about 15 to about 50%, and a total thickness of the polyimide layer is in a range of from about 50 to about 85%. Each thickness of the first copper foil layer and the second copper foil layer is in a range of from about 30 to about 80 μm, and the total thickness of the composite layer is in a range of from about 40 to about 60 μm.