The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Oct. 14, 2015
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Howard E. Chen, Anaheim, CA (US);

Matthew Sean Read, Rancho Santa Margarita, CA (US);

Hoang Mong Nguyen, Fountain Valley, CA (US);

Anthony James LoBianco, Irvine, CA (US);

Guohao Zhang, Nanjing, CN;

Dinhphuoc Vu Hoang, Anaheim, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/04 (2006.01); H04B 15/02 (2006.01); H01L 23/552 (2006.01); H04B 1/16 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01Q 1/52 (2006.01); H04B 1/44 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 23/522 (2006.01); G06F 17/50 (2006.01); H04B 15/04 (2006.01);
U.S. Cl.
CPC ...
H04B 15/02 (2013.01); H01L 21/561 (2013.01); H01L 23/5226 (2013.01); H01L 23/552 (2013.01); H01L 24/97 (2013.01); H01Q 1/526 (2013.01); H04B 1/16 (2013.01); H04B 1/44 (2013.01); H05K 1/023 (2013.01); H05K 1/115 (2013.01); G06F 17/5081 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H04B 15/04 (2013.01); H05K 2201/09618 (2013.01);
Abstract

Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.


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