The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Oct. 19, 2016
Applicant:

Otter Products, Llc, Fort Collins, CO (US);

Inventors:

Kevin W. Witter, Fort Collins, CO (US);

Matthew S. Krajec, Loveland, CO (US);

Patrick J. Nelson, Fort Collins, CO (US);

Paul N. Walker, Fort Collins, CO (US);

Thomas D. Boileau, Fort Collins, CO (US);

Assignee:

Otter Products, LLC, Fort Collins, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/3888 (2015.01); H05K 5/03 (2006.01); B65D 81/02 (2006.01); A45C 11/00 (2006.01); G06F 1/16 (2006.01); A45C 5/02 (2006.01); A45F 5/00 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H04B 1/3888 (2013.01); A45C 5/02 (2013.01); A45C 11/00 (2013.01); A45F 5/00 (2013.01); B65D 81/022 (2013.01); G06F 1/1656 (2013.01); H04M 1/0202 (2013.01); H05K 5/03 (2013.01); A45C 2011/001 (2013.01); A45C 2011/002 (2013.01); A45C 2011/003 (2013.01); G06F 2200/1633 (2013.01);
Abstract

A protective enclosure for an electronic device includes a cushion layer and a structural layer. The cushion layer covers the back surface and side surfaces of the installed electronic device. The structural layer is disposed over the cushion layer and includes a back portion, a right side portion, and a left side portion. The structural layer includes a thinned region on the back portion. The thinned region has a thickness that is less than the thickness of the remainder of the back portion of the structural layer. The thinned region of the structural layer allows a section of the protective enclosure to bend away from the back surface of the electronic device for installation and removal of the electronic device from the protective enclosure.


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