The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

May. 26, 2016
Applicant:

Delta Electronics Int'l (Singapore) Pte Ltd, Singapore, SG;

Inventors:

Yiu-Wai Lai, Singapore, SG;

Da-Jung Chen, Singapore, SG;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/48 (2006.01); H05K 7/20 (2006.01); H01L 25/18 (2006.01); H01L 23/36 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/18 (2013.01); H01L 25/115 (2013.01); H01L 25/18 (2013.01); H05K 1/0206 (2013.01); H05K 7/209 (2013.01); H01L 2224/18 (2013.01); H05K 1/0207 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10416 (2013.01);
Abstract

A power module includes a substrate, a first sub-module and a second sub-module. The substrate includes plural first conducting parts, plural second conducting parts and a third conducting part. The first sub-module is disposed on the substrate, and includes a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected with the corresponding first conducting parts. The third electrode is electrically connected with the third conducting part. The second sub-module is disposed on the substrate, and includes a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode. The fourth electrode and the fifth electrode are electrically connected with the corresponding second conducting parts. The sixth electrode is electrically connected with the third conducting part.


Find Patent Forward Citations

Loading…