The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Sep. 30, 2015
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Kazuhito Hatta, Fukushima, JP;
Mashio Shibuya, Fukushima, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 8/04 (2016.01); H01M 2/02 (2006.01); H01M 2/06 (2006.01); H01M 4/13 (2010.01); H01M 10/04 (2006.01); H01M 10/052 (2010.01); H01M 10/0525 (2010.01); H01M 10/0565 (2010.01); H01M 10/0587 (2010.01); H01M 2/08 (2006.01); H01M 2/16 (2006.01); H01M 4/06 (2006.01); H01M 4/131 (2010.01); H01M 4/133 (2010.01); H01M 4/62 (2006.01); H01M 4/66 (2006.01); H01M 6/02 (2006.01); H01M 6/16 (2006.01); H01M 6/18 (2006.01); H01M 10/0568 (2010.01); H01M 10/0569 (2010.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B29C 65/02 (2006.01); B29C 65/08 (2006.01); B29C 65/00 (2006.01); B32B 5/14 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01); B32B 27/34 (2006.01); B29C 65/18 (2006.01); B29K 655/00 (2006.01); B29L 31/00 (2006.01); B29L 31/34 (2006.01); B29K 705/02 (2006.01);
U.S. Cl.
CPC ...
H01M 2/0287 (2013.01); B29C 65/02 (2013.01); B29C 65/08 (2013.01); B29C 65/18 (2013.01); B29C 66/1122 (2013.01); B29C 66/32 (2013.01); B29C 66/41 (2013.01); B29C 66/433 (2013.01); B29C 66/71 (2013.01); B29C 66/72321 (2013.01); B29C 66/7352 (2013.01); B29C 66/83221 (2013.01); B32B 5/142 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); H01M 2/021 (2013.01); H01M 2/026 (2013.01); H01M 2/029 (2013.01); H01M 2/0267 (2013.01); H01M 2/0277 (2013.01); H01M 2/0285 (2013.01); H01M 2/06 (2013.01); H01M 2/08 (2013.01); H01M 2/162 (2013.01); H01M 2/1653 (2013.01); H01M 2/1673 (2013.01); H01M 4/06 (2013.01); H01M 4/13 (2013.01); H01M 4/131 (2013.01); H01M 4/133 (2013.01); H01M 4/623 (2013.01); H01M 4/625 (2013.01); H01M 4/661 (2013.01); H01M 6/02 (2013.01); H01M 6/164 (2013.01); H01M 6/166 (2013.01); H01M 6/181 (2013.01); H01M 10/0431 (2013.01); H01M 10/052 (2013.01); H01M 10/0525 (2013.01); H01M 10/0565 (2013.01); H01M 10/0568 (2013.01); H01M 10/0569 (2013.01); H01M 10/0587 (2013.01); B29C 66/81431 (2013.01); B29K 2623/12 (2013.01); B29K 2655/00 (2013.01); B29K 2705/02 (2013.01); B29L 2031/3468 (2013.01); B29L 2031/7146 (2013.01); B32B 2250/03 (2013.01); B32B 2255/06 (2013.01); B32B 2274/00 (2013.01); B32B 2323/10 (2013.01); B32B 2367/00 (2013.01); B32B 2457/10 (2013.01); B32B 2553/00 (2013.01); H01M 2220/30 (2013.01); H01M 2300/0037 (2013.01); H01M 2300/0082 (2013.01); Y02E 60/122 (2013.01);
Abstract
A cell in which thermal welding of a laminate packaging is performed so that the thickness of a thermal welded portion including an electrode terminal is larger than that of a thermal welded portion including no electrode terminal.